JPH0238446Y2 - - Google Patents

Info

Publication number
JPH0238446Y2
JPH0238446Y2 JP1981122445U JP12244581U JPH0238446Y2 JP H0238446 Y2 JPH0238446 Y2 JP H0238446Y2 JP 1981122445 U JP1981122445 U JP 1981122445U JP 12244581 U JP12244581 U JP 12244581U JP H0238446 Y2 JPH0238446 Y2 JP H0238446Y2
Authority
JP
Japan
Prior art keywords
die
semiconductor element
pad
bonding
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981122445U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5827935U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12244581U priority Critical patent/JPS5827935U/ja
Publication of JPS5827935U publication Critical patent/JPS5827935U/ja
Application granted granted Critical
Publication of JPH0238446Y2 publication Critical patent/JPH0238446Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP12244581U 1981-08-18 1981-08-18 混成集積回路装置 Granted JPS5827935U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12244581U JPS5827935U (ja) 1981-08-18 1981-08-18 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12244581U JPS5827935U (ja) 1981-08-18 1981-08-18 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS5827935U JPS5827935U (ja) 1983-02-23
JPH0238446Y2 true JPH0238446Y2 (en]) 1990-10-17

Family

ID=29916366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12244581U Granted JPS5827935U (ja) 1981-08-18 1981-08-18 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS5827935U (en])

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127338A (ja) * 1982-01-25 1983-07-29 Sharp Corp 電子部品の構造
JPS6122728U (ja) * 1984-07-16 1986-02-10 株式会社吉野工業所 容器
US10624621B2 (en) 2006-11-07 2020-04-21 Corvia Medical, Inc. Devices and methods for the treatment of heart failure
US20110257723A1 (en) 2006-11-07 2011-10-20 Dc Devices, Inc. Devices and methods for coronary sinus pressure relief
US10413284B2 (en) 2006-11-07 2019-09-17 Corvia Medical, Inc. Atrial pressure regulation with control, sensing, monitoring and therapy delivery
US9232997B2 (en) 2006-11-07 2016-01-12 Corvia Medical, Inc. Devices and methods for retrievable intra-atrial implants
US9757107B2 (en) 2009-09-04 2017-09-12 Corvia Medical, Inc. Methods and devices for intra-atrial shunts having adjustable sizes
EP2528646A4 (en) 2010-01-29 2017-06-28 DC Devices, Inc. Devices and systems for treating heart failure
AU2011210741B2 (en) 2010-01-29 2013-08-15 Corvia Medical, Inc. Devices and methods for reducing venous pressure
CA2827025C (en) 2011-02-10 2020-09-01 Dc Devices, Inc. Apparatus and methods to create and maintain an intra-atrial pressure relief opening
US12303119B2 (en) 2011-02-10 2025-05-20 Corvia Medical, Inc. Apparatus and methods to create and maintain an intra-atrial pressure relief opening
US20130178784A1 (en) 2011-12-22 2013-07-11 Dc Devices, Inc. Methods and devices for intra-atrial shunts having adjustable sizes
US10675450B2 (en) 2014-03-12 2020-06-09 Corvia Medical, Inc. Devices and methods for treating heart failure
US10632292B2 (en) 2014-07-23 2020-04-28 Corvia Medical, Inc. Devices and methods for treating heart failure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150251A (en) * 1979-05-11 1980-11-22 Hitachi Ltd Semiconductor device
JPS5797634A (en) * 1980-12-11 1982-06-17 Canon Inc Hybrid integrated circuit

Also Published As

Publication number Publication date
JPS5827935U (ja) 1983-02-23

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